Raider GT Electrochemical Deposition

Electro-chemical deposition (ECD) is a rapid and cost-effective method used to lay down the bulk of the copper wiring in semiconductor device manufacturing. The wiring is used to create the interconnects needed to form the electrical circuits. For the circuit to function properly, it is essential that the metal completely fills the features of this wiring (vias and trenches) without seams or voids, which would jeopardize electrical reliability and functionality.

As feature sizes scale down to less than 20nm and their aspect ratios increase (>5:1), it becomes increasingly difficult to achieve the balance of bottom-up fill and sidewall suppression that produces flawless fill. In addition, thinner seed layers, with increased resistance, and higher device densities make it more difficult to achieve uniform deposition across the wafer to achieve high device yields.